Market Overview
From 2021 to 2030, the worldwide 3D IC market is predicted to increase at a CAGR of 20%, from $9.18 billion in 2020 to $51.81 billion in 2030.
Three-dimensional integrated circuits (ICs) are integrated circuits with two or more circuitry layers in a single container. Both vertically and horizontally, the layers are intertwined. Typically, multi-layer chips are made by manufacturing stacking distinct layers and then thinning them.
Market Segmentation
The 3D IC Market is divided into four segments: application, technology, component, as well as products. The 3D IC Market is divided into automotive, defence and aerospace, telecommunication and IT, medical, industrial, consumer electronics, and others.
The 3D IC Market Size is further divided into Through Glass Vias (YGVs), Through Silicon Sensors (TSVs), and Others based on the components.
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The 3D integrated circuit market is divided into two categories based on technology: type and integration and packaging. 3D Wafer-level packaging (WLP), 3D Heterogeneous Integration, 2.5 and 3D interposing, as well as 3D system-in-package are the different types of integration and packaging (SIP). The type section is then split into Monolithic 3D ICs and 3D stacked ICs.
The 3D IC market is divided into Sensors and MEMS, Light Emitting Diodes, 3D Memory, plus CMOS image sensors based on goods (CIS).
Regional Classification
The 3D Integrated Circuit Market Size is divided into four regions: Asia-Pacific, Europe, North America, as well as the Rest of the World. The Asia-Pacific area is expected to have the biggest market share during the projection period. Several variables are heavily promoting the market. The increased need for consumer electronics among nations is one of the key drivers. Nations like India, China, Malaysia, South Korea, and others are rapidly developing. In addition, the growing awareness of technological advancements and the use of smart gadgets is propelling the market in this region forward.
Following that, the North American area will have the second-largest market share for 3D Integrated Circuits. One of the main causes for the rise is the easy availability of substitutes and well-developed infrastructure. In addition, the rising demand for Integrated Circuits within nations such as Canada and the United States is propelling the industry forward.
Industry News
Vertically stacking integrated circuits (ICs) or circuitry as a viable method for achieving electronic device needs such as improved performance, enhanced functionality, reduced power consumption, and a smaller footprint has arisen in semiconductors. 3D integration technologies refer to the different ways and processes utilized to accomplish this.
Semiconductor technology is supposed to bring value to a semiconductor product by boosting and sustaining performance whilst reducing the overall cost of packaging. High-performance chips for different consumer electrical items are being demanded due to the development of semiconductor packaging. The need for 3D IC chips used in smartphones and other mobile devices will increase as a result.
The high use of electronic devices, rising need for the internet of things (IoT) technology, and technological advancements in 3D packaging technology are major drivers driving the 3D IC market growth. The rapid advancement of 3D packaging technology has propelled the 3D IC market's revenue development. 3D packaging's technological benefits fuel its need in high-end applications like memory chips, computers, NAND, DRAMS, imaging and optoelectronics, etc.
