Multi-chip modules (MCM) are an electronic assembly with the integration of several dies or processors on a single device. Its high density and improved electrical performance can drive its development among chip manufacturing companies. The lamination process is highly preferred for adding multiple chips on a substrate owing to various refinements such as spacings and vias. The global multi-chip module market report by Market Research Future (MRFR) provides an overview of the changes in semiconductor manufacturing, rise of consumer applications, and other projections for the period of 2018 to 2023 (forecast period). The COVID-19 pandemic and its impact are recorded in the report.
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Globally, the Global Multi-chip Module Market is expected to grow at a CAGR of 6.1% during the forecast period. The sale of portable and wireless consumer products is predicted to fuel market demand. Rising miniaturization of processors and ICs owing to notebook and camera applications can support this trend. Improvement in performance, low weight and size, and low power supply requirements are benefits of MCM which can spur its demand among consumer electronics manufacturers. Development of 3D ICs with heterogenous dies which includes various encryption standards and power integrity features can bode well for the market. The large computing and simulation requirements by growing industries and memory kits which can transfer data at gigabit rates are likely to trigger demand for multi-chip modules.
But lack of innovation in chip manufacturing and skilled personnel can impede market growth.
The geographical analysis of global multi-chip module market Analysis is studied for North America, Europe, Asia Pacific (APAC), and Rest-of-the-World (RoW).
Asia Pacific is expected to dominate the global multi-chip module market during the forecast period. The region is considered as the most potential region in terms of development and adoption of multi-chip modules and respective electronic products. It has a huge potential for revenue generation in the multi-chip module market, particularly from consumer electronics industry vertical. China is expected to be the dominating country in the multi-chip module market in Asia-Pacific region during the forecast period.
North America is expected to grow at the fastest rate during the forecast period. Innovative technologies and presence of many leading vendors in the region are some of the driving factors for the multi-chip module market in the region.
The global multi-chip module market Analysis is segmented into type and industry vertical.
By type, the market is segmented into NAND-based MCP, NOR-based MCP, eMCP, and uMCP.
By industry vertical, the market is segmented into consumer electronics, automotive, medical devices, aerospace and defense, and others. The consumer electronics vertical is expected to generate revenue sales for the global multi-chip module industry owing to consumption of consumer electronic products. The need for extended memory for storing multimedia files and higher processing power for running simulations and rendering of animated sequences can drive the segment growth. On the other hand, the automotive vertical can capture a large market share owing to emergence of connected cars and rise in development of autonomous vehicles
TEKTRONIX, INC., Micross, Cypress Semiconductor, Palomar Technologies, Macronix International Co., Ltd., Texas Instruments, Samsung Electronics, SK HYNIX INC., STMicroelectronics, and Infineon Technologies are key players of the global multi-chip module market.
Recently, NEC Corporation agreed to partner with NXP Semiconductors for supply of MCM modules for its use in a 5G radio antenna unit. This can expedite the deployment of 5G technologies globally.
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