The building block for creating microelectronic devices is silicon wafers (i.e., silicon microchips). A silicon wafer is a small piece of completely pure silicon customarily made from a single, extremely pure silicon crystal. To increase the working life of our products, Kensington Laboratories offer you stage repair services.
How does it function?
Most electrical gadgets are constructed from silicon, with silicon wafers as the foundation. Microchips cut from silicon wafers are used to manufacture a variety of electronic products, including memory sticks, hearing aids, MP3 players, cameras, camera sensors, microwave oven control panels, WiFi boxes, solar cells, and credit card security chips. The circuitry for each of these various purposes is created by printing different circuitry patterns on the silicon.
In what ways are silicon wafers produced?
Silicon wafers are produced in a range of diameters, from 50mm diameter wafers used for some specialist products to 300mm diameter wafers used for mass production of digital memory and microprocessor chips.
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Different Stages of Manufacturing
Steps 1-4 are used in the production of blank silicon wafers.
Steps 5-6 A blank wafer is transformed into a finished wafer packed with microelectronic components.
Steps 7-9 A finished wafer is processed “back end” in these steps to create usable electrical components.
- Pure elemental silicon can be refined from common sand (which is mostly silicon dioxide, also called “silica”).
- To create a sizable single crystal of silicon that resembles a vast salami, carefully melt the silicon and re-crystallize it.
- Cut slices from the giant crystal; these slices are blank silicon wafers with a rough cut.
- Each silicon wafer's surface should be polished.
- To create microelectronic devices, print circuit designs on the polished surface of the wafer. A complicated design of electrical components and associated wires may be the end product of this printing process, which often entails numerous steps in which various layers are piled up on the silicon wafer surface, each layer having a different pattern. Typically, this printing technique is referred to as “microlithography.”
- An entire silicon wafer is typically significantly smaller than a complete microelectronic device. The microelectronic device is printed in large numbers on the silicon wafer in a symmetrical array during the printing process.
- The wafer is examined for faults when printing is complete, and each duplicate of the microelectronic device is electrically checked to look for malfunctions or problems. On a map, incorrect copies are identified, and an ink dot is occasionally used to indicate them.
- The microelectronic device copies are then separated from the wafer using a saw. Even though each individual wafer piece is referred to as a “chip,” the wafers are cut very precisely without chisels. Dicing is the term used to describe the act of breaking a wafer into several chips, which are typically rectangular.
- The silicon chip is placed inside a protective container, often manufactured of plastic or ceramic, with metal terminals for electrical links to the chip, as the last step in the manufacturing process.
Why Are Wafers So Important?
The primary component utilized to create practically all electronic gadgets is silicon wafers.
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