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Thermal interface materials (TIM) are materials inserted between two components to increase the thermal heat between them. The global thermal interface materials market report by Market Research Future (MRFR) looks at the impact of product miniaturization and the production of various consumer electronic products. In addition, it highlights drivers, restraints, trends, and opportunities for the period of 2022-2030 (forecast period).
Market Scope
The global thermal interface materials market is expected to reach a significant valuation by exhibiting a CAGR of 10.4% during the forecast period. It is driven by the need for faster computing and execution of tasks. Awareness of efficient lighting systems and saving of power bills has led to the adoption of LED lights over conventional lights. The thermal interface materials act as a medium for controlling the heat within the device to prevent overload on the main system.
Product miniaturization due to the breakthroughs in integrated circuit designs and faster speeds of processors will work in favor of the market. The increasing demand for thermal greases and die in light of massive demand for power will drive the need for these materials. They can control power leakage and improve the performance of the devices. For instance, Shin-Etsu’s thermal materials ensure thermal conductivity while ensuring the separation of electrical components.
Rise of consumer electronic products owing to the proliferation of the Internet is likely to induce heavy demand for thermal interface materials for power electronics applications. Technologies such as artificial intelligence, machine learning, and construction of large data servers as well as the continuous production to keep up with the growing demand of electronic devices will bode well for the market.
Segmentation
The global thermal interface materials market is segmented by type and application.
By type, it is segmented into elastomeric pads, metal based, gap fillers, greasers & adhesives, and others.
By application, it is segmented into industrial machinery, telecommunications, automotive, computer, and others. The telecommunications segment is touted to be beneficial to the TIM market owing to the demand for connectivity across devices and procurement of consumer electronic devices. This is primarily influenced by the massive sales of smartphones.
Regional Analysis
Based on regions, the global Thermal Interface Materials Market is segmented into North America, Europe, Asia Pacific (APAC), and Rest-of-the-World (RoW).
North America is touted to dominate the market owing to the growth in information technology (IT) and telecommunications industries. Development for carbon nanotubes due to electrical and thermal conductivity will bode well for the global thermal interface materials market. Furthermore, inclination towards electric and hybrid vehicles as well as rapid industrialization will accelerate its demand. The high internet bandwidth required for data speeds will also act as a catalyst for market growth.
APAC will be highly lucrative for the global TIM market due to the continuous demand for electronic devices in China and India. The automotive and construction sectors can induce demand for phase change materials as well. Sustainable policies enforced by governments for preventing greenhouse gas emissions from rising will be the driving force of the regional thermal interface materials market. Development of commercial and residential buildings will influence the domestic demand.
Competition Outlook
Indium Corporation, Parker Chomerics, Momentive Performance Materials Inc., Zalman Tech Co., Ltd., Bergquist Company, Henkel Corporation, 3M Company, Laird Technologies, Dow Corning, and others are key players of the global thermal interface materials market. Players are creating manufacturing units to add value to the supply chain and lowering production costs.
Industry News
Fujipoly has introduced a new TIM, Sarcon PG45A, for use in electronic components with high rates of material compression. The thermal gap filler will act as a medium between the heat source and the sink.
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