BGA PCB Assembly

A ball grid array assembly is a type of surface-mount packaging (a chip carrier) used for integrated circuits. BGA packages are used to permanently mount devices such as microprocessors. A BGA China can provide more interconnection pins than can be put on a dual in-line or flat package. The whole bottom surface of the device can be used, instead of just the perimeter. The traces connecting the package's leads to the wires or balls which connect the die to package are also on average shorter than with a perimeter-only type, leading to better performance at high speeds.

Soldering of BGA devices requires precise control and is usually done by automated processes.

Advantages of China BGA PCB Assembly

Heat conduction: BGA circuits allow heat to pass much more easily from the integrated circuit outwards, reducing overheating problems.

Lower inductance: Because each solder ball in a BGA circuit is generally only a handful of millimeters large, problems from interference within the circuit are greatly minimized.

Higher-density circuits: As through-hole circuits of PCB assembly BGA were more densely-populated, soldering them accurately without crossover or short-circuits became nearly impossible.

BGA PCB Features

Types of BGA PCBs

Inspection of BGA PCB

Types of BGA PCBs

CBGA (Ceramic Ball Grid Array)

PBGA (Plastic Ball Grid Array) TBGA (Tape Ball Grid Array)

X-ray inspection is used to analysis the features of BGA PCBs. This technique is known as XRD in the industry and relies on X-rays for unveiling the hidden features of this PCB. This kind of inspection includes: Solder Joint Thickness, Solder Joint Radius, Change in Circular shape and Solder Joint Position

As a bga company, we can provide kinds of bga assembly for sale, anything you need, please contact us.

GreensTone offers a full turnkey contract manufacturing China service with its strategic partners including PCB manufacturing, PCB components procurement, PCBA (Printed Circuit Board Assembly) manufacturing service and provide molding service with plastic and metal parts as a value-add service. Mainly focused on EMS (Electronics Manufacturing Service) integrated manufacturing and assembly.