The TC350 Plus from <strong>Kingford PCB & Assembly</strong> are PTFE-based composite materials reinforced with woven glass and filled with ceramic. These materials provide high thermal conductivity and exceptional thermal dissipation in a circuit board. The advanced filler system also allows this composite to possess improved drilling performance. The improved drilling performance results in reduced manufacturing costs. These laminates are ideal for high-power RF signal applications, such as power amplifiers and passive components sensitive to temperature phase stability。
The new material features a combination of lower tangent and insertion loss, low moisture absorption, and excellent dimensional stability. The low loss tangent and high thermal conductivity properties of <strong>TC350 Plus</strong> materials help improve the reliability of the panels and reduce operating temperatures. In addition, they are present in various sizes. As a result, we can use them for different types of applications. They are also a preferred choice for telecommunications and other high-power applications.
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RO4835 high-frequency laminates from Rogers Electronics have improved oxidation resistance and a dielectric constant of 3.48. They exhibit low loss tangent at the 10 GHz mark and are compatible with lead-free processing methods. Their low loss tangent and high electrical stability make them viable for demanding <strong>RF/microwave circuits</strong>. They also exhibit similar expansion coefficients to copper and are RoHS-compliant.
High-frequency laminates are better for projects with broad mechanical, electrical, and mechanical requirements. <strong>Rogers TC350</strong> Plus laminates exhibit low loss tangents, reducing the cost of a high-frequency board. The loss factor, or Df, is a significant consideration when choosing the best material for your circuit boards. It’s the essential aspect of a printed circuit board, and the type of material is the biggest determining factor. For example, if you use FR-4 materials, you will experience higher losses.
High thermally conductive fillers
Designed for RF signal applications, TC Series(tm) laminates from Rogers Corporation feature high thermal conductivity, low loss tangent, and excellent drilling performance. With their high thermal conductivity and high dielectric strength, they are ideal for high-power RF designs, including power amplifiers and passive components that are sensitive to changes in dielectric constant with temperature.
<strong>TC350 Plus</strong> laminates feature a unique combination of low tangent and insertion losses and high thermally conductive fillers. Combining these features increases reliability and reduces operating temperatures in high-power applications. As a result, we can use them for various high-performance applications, including RF antennas, power dividers, couplers, filters, and amplifiers.
Rogers’s high thermally conductive circuit material is suitable for RF and microwave applications. Unlike standard PTFE materials, it has an impressive thermal conductivity of almost twice the standard RT/duroid 6000 products. The circuit material also boasts excellent drill-ability, which reduces drilling costs. Once you’ve decided on the Rogers TC350 Plus Laminates material for your application, you’ll want to consider the many benefits.
<strong>Arlon TC 350</strong> laminate is a superior PCB substrate. It has superior heat-transfer properties and can help in various high-frequency applications, including digital communication control systems and power amplifiers. It also boasts a low insertion loss and has low CTE. It’s also easy to fabricate. Using industry-standard manufacturing processes, you can assemble the Rogers TC 350 laminate and store it in a flat, cool environment, away from sunlight.
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